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11th international congress molded interconnect devices : scientific proceedings : selected, peer reviewed papers from the 11th International Congress Molded Interconnect Devices (MID 2014), September 24-25, 2014, Nuremberg / Fuerth, Germany / / edited by Jörg Franke [and three others]
| 11th international congress molded interconnect devices : scientific proceedings : selected, peer reviewed papers from the 11th International Congress Molded Interconnect Devices (MID 2014), September 24-25, 2014, Nuremberg / Fuerth, Germany / / edited by Jörg Franke [and three others] |
| Pubbl/distr/stampa | Pfaffikon, Switzerland : , : TTP, , 2014 |
| Descrizione fisica | 1 online resource (119 p.) |
| Disciplina | 621.367 |
| Collana | Advanced Materials Research |
| Soggetto topico |
Molded interconnect devices
Three-dimensional display systems |
| Soggetto genere / forma | Electronic books. |
| ISBN | 3-03826-636-1 |
| Formato | Materiale a stampa  |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto |
11th International Congress Molded Interconnect Devices - Scientific Proceedings; Preface and Committees; Table of Contents; Chapter 1: Development and Prototyping; Method for the Identification and Comparison of Alternative Process Chains Focusing on Economics Efficiency Analysis during the Conceptual Design of Mechatronic Integrated Devices; Novel Approach for the Implementation of 3D-MID Compatible Routing Functionalities into Computer-Aided Design Tools; Optimized Process Sequences for Prototyping of Molded Interconnect Devices; Integration of Functional Circuits into FDM Parts
Chapter 2: Printing TechnologiesPrinting of Functional Structures on Molded 3D Devices; Electrical Functionalization of Thermoplastics by Combining Plasmadust Coating and Aerosol Jet Printing; Production of Miniaturized Sensor Structures on Polymer Substrates Using Inkjet Printing; Progress in the Manufacturing of Molded Interconnected Devices by 3D Microcontact Printing; Chapter 3: Materials and Manufacturing; Characterization of Electromagnetic Properties of MID Materials for High Frequency Applications up to 67 GHz Novel Laser Induced Metallization for Three Dimensional Molded Interconnect Device Applications by Spray MethodExperimental Investigation of Laser Sintering of Conductive Adhesive for Functional Prototypes Produced by Embedding Stereolithography; MID Fabricated by Ultrasonic Processing; Usage of Industrial Robots as Flexible Handling Devices Supporting the Process of Three Dimensional Conductive Pattern Generation; Chapter 4: Manufacturing Processes; Study of MID Technologies for Automotive Lighting and Light Signaling Devices; Chapter 5: Assembly Technologies and Inspection Design and Solder Process Optimization in MID Technology for High Power ApplicationsChapter 6: Quality and Reliability; Hot Pin Pull Method - New Test Procedure for the Adhesion Measurement for 3D-MID; Keywords Index; Authors Index |
| Record Nr. | UNINA-9910460003603321 |
| Pfaffikon, Switzerland : , : TTP, , 2014 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||
11th international congress molded interconnect devices : scientific proceedings : selected, peer reviewed papers from the 11th International Congress Molded Interconnect Devices (MID 2014), September 24-25, 2014, Nuremberg / Fuerth, Germany / / edited by Jörg Franke [and three others]
| 11th international congress molded interconnect devices : scientific proceedings : selected, peer reviewed papers from the 11th International Congress Molded Interconnect Devices (MID 2014), September 24-25, 2014, Nuremberg / Fuerth, Germany / / edited by Jörg Franke [and three others] |
| Pubbl/distr/stampa | Pfaffikon, Switzerland : , : TTP, , 2014 |
| Descrizione fisica | 1 online resource (119 p.) |
| Disciplina | 621.367 |
| Collana | Advanced Materials Research |
| Soggetto topico |
Molded interconnect devices
Three-dimensional display systems |
| ISBN | 3-03826-636-1 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto |
11th International Congress Molded Interconnect Devices - Scientific Proceedings; Preface and Committees; Table of Contents; Chapter 1: Development and Prototyping; Method for the Identification and Comparison of Alternative Process Chains Focusing on Economics Efficiency Analysis during the Conceptual Design of Mechatronic Integrated Devices; Novel Approach for the Implementation of 3D-MID Compatible Routing Functionalities into Computer-Aided Design Tools; Optimized Process Sequences for Prototyping of Molded Interconnect Devices; Integration of Functional Circuits into FDM Parts
Chapter 2: Printing TechnologiesPrinting of Functional Structures on Molded 3D Devices; Electrical Functionalization of Thermoplastics by Combining Plasmadust Coating and Aerosol Jet Printing; Production of Miniaturized Sensor Structures on Polymer Substrates Using Inkjet Printing; Progress in the Manufacturing of Molded Interconnected Devices by 3D Microcontact Printing; Chapter 3: Materials and Manufacturing; Characterization of Electromagnetic Properties of MID Materials for High Frequency Applications up to 67 GHz Novel Laser Induced Metallization for Three Dimensional Molded Interconnect Device Applications by Spray MethodExperimental Investigation of Laser Sintering of Conductive Adhesive for Functional Prototypes Produced by Embedding Stereolithography; MID Fabricated by Ultrasonic Processing; Usage of Industrial Robots as Flexible Handling Devices Supporting the Process of Three Dimensional Conductive Pattern Generation; Chapter 4: Manufacturing Processes; Study of MID Technologies for Automotive Lighting and Light Signaling Devices; Chapter 5: Assembly Technologies and Inspection Design and Solder Process Optimization in MID Technology for High Power ApplicationsChapter 6: Quality and Reliability; Hot Pin Pull Method - New Test Procedure for the Adhesion Measurement for 3D-MID; Keywords Index; Authors Index |
| Record Nr. | UNINA-9910787022703321 |
| Pfaffikon, Switzerland : , : TTP, , 2014 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||
11th international congress molded interconnect devices : scientific proceedings : selected, peer reviewed papers from the 11th International Congress Molded Interconnect Devices (MID 2014), September 24-25, 2014, Nuremberg / Fuerth, Germany / / edited by Jörg Franke [and three others]
| 11th international congress molded interconnect devices : scientific proceedings : selected, peer reviewed papers from the 11th International Congress Molded Interconnect Devices (MID 2014), September 24-25, 2014, Nuremberg / Fuerth, Germany / / edited by Jörg Franke [and three others] |
| Pubbl/distr/stampa | Pfaffikon, Switzerland : , : TTP, , 2014 |
| Descrizione fisica | 1 online resource (119 p.) |
| Disciplina | 621.367 |
| Collana | Advanced Materials Research |
| Soggetto topico |
Molded interconnect devices
Three-dimensional display systems |
| ISBN | 3-03826-636-1 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Nota di contenuto |
11th International Congress Molded Interconnect Devices - Scientific Proceedings; Preface and Committees; Table of Contents; Chapter 1: Development and Prototyping; Method for the Identification and Comparison of Alternative Process Chains Focusing on Economics Efficiency Analysis during the Conceptual Design of Mechatronic Integrated Devices; Novel Approach for the Implementation of 3D-MID Compatible Routing Functionalities into Computer-Aided Design Tools; Optimized Process Sequences for Prototyping of Molded Interconnect Devices; Integration of Functional Circuits into FDM Parts
Chapter 2: Printing TechnologiesPrinting of Functional Structures on Molded 3D Devices; Electrical Functionalization of Thermoplastics by Combining Plasmadust Coating and Aerosol Jet Printing; Production of Miniaturized Sensor Structures on Polymer Substrates Using Inkjet Printing; Progress in the Manufacturing of Molded Interconnected Devices by 3D Microcontact Printing; Chapter 3: Materials and Manufacturing; Characterization of Electromagnetic Properties of MID Materials for High Frequency Applications up to 67 GHz Novel Laser Induced Metallization for Three Dimensional Molded Interconnect Device Applications by Spray MethodExperimental Investigation of Laser Sintering of Conductive Adhesive for Functional Prototypes Produced by Embedding Stereolithography; MID Fabricated by Ultrasonic Processing; Usage of Industrial Robots as Flexible Handling Devices Supporting the Process of Three Dimensional Conductive Pattern Generation; Chapter 4: Manufacturing Processes; Study of MID Technologies for Automotive Lighting and Light Signaling Devices; Chapter 5: Assembly Technologies and Inspection Design and Solder Process Optimization in MID Technology for High Power ApplicationsChapter 6: Quality and Reliability; Hot Pin Pull Method - New Test Procedure for the Adhesion Measurement for 3D-MID; Keywords Index; Authors Index |
| Record Nr. | UNINA-9910811577503321 |
| Pfaffikon, Switzerland : , : TTP, , 2014 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||
2009 IEEE Symposium on 3D User Interfaces
| 2009 IEEE Symposium on 3D User Interfaces |
| Pubbl/distr/stampa | [Place of publication not identified], : IEEE, 2009 |
| Descrizione fisica | 1 online resource (x, 159 pages) : illustrations |
| Disciplina | 621.367 |
| Soggetto topico |
Three-dimensional display systems
User interfaces (Computer systems) Virtual reality |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Record Nr. | UNISA-996216374403316 |
| [Place of publication not identified], : IEEE, 2009 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. di Salerno | ||
| ||
2009 IEEE Symposium on 3D User Interfaces
| 2009 IEEE Symposium on 3D User Interfaces |
| Pubbl/distr/stampa | [Place of publication not identified], : IEEE, 2009 |
| Descrizione fisica | 1 online resource (x, 159 pages) : illustrations |
| Disciplina | 621.367 |
| Soggetto topico |
Three-dimensional display systems
User interfaces (Computer systems) Virtual reality |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Record Nr. | UNINA-9910140044203321 |
| [Place of publication not identified], : IEEE, 2009 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||
2011 IEEE Symposium on 3D User Interfaces
| 2011 IEEE Symposium on 3D User Interfaces |
| Pubbl/distr/stampa | [Place of publication not identified], : IEEE, 2011 |
| Descrizione fisica | 1 online resource (x, 142 pages) : illustrations |
| Disciplina | 621.367 |
| Soggetto topico |
Three-dimensional display systems
Interfícies d'usuari (Sistemes d'ordinadors) Visualització tridimensional |
| Soggetto genere / forma |
Congressos
Llibres electrònics |
| ISBN | 1-4577-0064-6 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Record Nr. | UNINA-9910141142203321 |
| [Place of publication not identified], : IEEE, 2011 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||
2011 IEEE Symposium on 3D User Interfaces
| 2011 IEEE Symposium on 3D User Interfaces |
| Pubbl/distr/stampa | [Place of publication not identified], : IEEE, 2011 |
| Descrizione fisica | 1 online resource (x, 142 pages) : illustrations |
| Disciplina | 621.367 |
| Soggetto topico |
Three-dimensional display systems
Interfícies d'usuari (Sistemes d'ordinadors) Visualització tridimensional |
| Soggetto genere / forma |
Congressos
Llibres electrònics |
| ISBN | 1-4577-0064-6 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Record Nr. | UNISA-996205198603316 |
| [Place of publication not identified], : IEEE, 2011 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. di Salerno | ||
| ||
2013 IEEE International Conference on Multimedia and Expo Workshops (ICMEW) / / IEEE
| 2013 IEEE International Conference on Multimedia and Expo Workshops (ICMEW) / / IEEE |
| Pubbl/distr/stampa | Piscataway, NJ : , : IEEE, , 2013 |
| Descrizione fisica | 1 online resource : illustrations |
| Disciplina | 621.3 |
| Soggetto topico | Three-dimensional display systems |
| ISBN | 1-4799-1604-8 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Altri titoli varianti |
2013 IEEE International Conference on Multimedia and Expo Workshops
Multimedia and Expo Workshops |
| Record Nr. | UNISA-996279644603316 |
| Piscataway, NJ : , : IEEE, , 2013 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. di Salerno | ||
| ||
2013 IEEE International Conference on Multimedia and Expo Workshops (ICMEW) / / IEEE
| 2013 IEEE International Conference on Multimedia and Expo Workshops (ICMEW) / / IEEE |
| Pubbl/distr/stampa | Piscataway, NJ : , : IEEE, , 2013 |
| Descrizione fisica | 1 online resource : illustrations |
| Disciplina | 621.3 |
| Soggetto topico | Three-dimensional display systems |
| ISBN | 1-4799-1604-8 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Altri titoli varianti |
2013 IEEE International Conference on Multimedia and Expo Workshops
Multimedia and Expo Workshops |
| Record Nr. | UNINA-9910132431003321 |
| Piscataway, NJ : , : IEEE, , 2013 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||
2013 IEEE Symposium on 3D User Interfaces (3DUI)
| 2013 IEEE Symposium on 3D User Interfaces (3DUI) |
| Pubbl/distr/stampa | [Place of publication not identified], : IEEE, 2013 |
| Disciplina | 005.4/37 |
| Soggetto topico |
User interfaces (Computer systems)
Three-dimensional display systems Virtual reality Engineering & Applied Sciences Computer Science |
| ISBN | 1-4673-6098-8 |
| Formato | Materiale a stampa |
| Livello bibliografico | Monografia |
| Lingua di pubblicazione | eng |
| Record Nr. | UNINA-9910132906003321 |
| [Place of publication not identified], : IEEE, 2013 | ||
| Materiale a stampa | ||
| Lo trovi qui: Univ. Federico II | ||
| ||
